Silver-Palladium-Platinum Pastes

Silver-Palladium-Platinum Conductive Pastes

Technical Specifications

PP-18	PP-19	PP-20	PP-21	PP-22	PP-31	PP-32	PP-33
Metallurgy	Ag/Pt	Ag/Pt	Ag/Pd/Pt	Ag/Pd/Pt	Ag/Pt	Ag/Pt	Ag/Pt
Fired layer thickness, µm	10 — 15
Resistance, 10-3*Ohm/sq, not more than	40	40	40	25	35	10	17	35
Solder coverage area 62Sn/36Pb/2Ag, 230°C, 5s, %, not less than	98	95	98	98	98	95	98	98
Resistance to leaching: (t=230°C, solder 62Sn/36Pb/2Ag), s, not less than	50	—	50	50	60	50	60	80
Adhesion, N: 2x2mm, solder 62Sn/36Pb/2Ag, 230°C, 5s	17..20	—	17..22	20…25	20…25	18…22	20…25	20…26
TU GK	EPO.035.006

APPLICATIONS

Pastes PP-18, PP-19, PP-20, PP-21, PP-22, PP-31, PP-32, PP-33 are recommended for creating conductive traces in the manufacture of hybrid integrated circuits (HICs), resistor microassemblies, as well as contact pads and electrodes for thick-film passive components on ceramic substrates VK-94-1, VK-94-2, VK-96.

Pastes PP-22 and PP-33 with high platinum content are characterized by high resistance to leaching and low silver migration, making them suitable for repairable circuits and devices.

Pastes PP-21 and PP-31 with low palladium and platinum content exhibit low resistivity and are used in applications where silver migration is not a critical factor.

Paste PP-19 is recommended for creating top-layer traces on a dielectric layer in the manufacture of multilayer interconnect boards.

The pastes are compatible with resistive pastes of the PRu-V(Ve), PRu-P series and dielectric pastes PD-8, PD-9, PD-10 and PD-11.