Gold-containing pastes
Ecotec gold-containing pastes for ceramic metallization and microassembly fabrication. Various grades for different applications.
The following paste grades are available: PZl-1, PZl-2, PZl-R, PZl-Rch, PZl-M, which differ in gold content, application methods, and purpose.
Applications:
PZl-1 and PZl-2 pastes are used for metallization of profiled ceramics by the drop method for subsequent mounting of silicon active elements by eutectic soldering at a temperature of 450…470 °C.
PZl-M paste is used for forming conductors by screen printing on ceramics in the manufacture of hybrid microassemblies.
PZl-R and PZl-Rch pastes are used for forming the electrode system of plasma panels by screen printing.
Technical specifications of PZl-1, PZl-2, PZl-M, PZl-R, and PZl-Rch pastes
|
Parameter |
PZl-1 |
PZl-2 |
|
Appearance |
Viscous mass from light brown to dark brown |
|
|
Conditional viscosity at 20…25 °C measured on funnel UB.44.076.000, s |
30…35 |
— |
|
Gold content, % by mass |
25.0…28.0 |
26.0…30.0 |
|
Organic binder content, % by mass |
71.0…75.0 |
— |
|
Parameter |
PZl-M |
PZl-R |
PZl-Rch |
|
Appearance |
Viscous homogeneous mass from light brown to dark brown |
Viscous homogeneous black mass |
|
|
Gold content, % by mass |
82.0…92.0 |
79.0…81.0 |
70.5…72.5 |
|
Conditional viscosity at 20…22 °C, mm |
19.0…23.0 |
17.0…20.0 |
17.0…20.0 |
|
Fineness of grind, μm, not more than |
20.0 |
12.0 |
12.0 |
|
Specific surface resistance of gold coating at conductor thickness 15 μm, Ohm/sq., not more than |
0.005 |
— |
|
|
Roughness of gold coating, Ra, μm, not more than |
2.5 |
— |
|
|
Die shear strength for crystal size (3.5*3.6) mm2 on gold coating, kgf, not less than |
2.5 |
— |
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